The main objective is to develop new and innovative hardware platforms to be embedded into materials of interest (composite, polymers, concrete, soil). The platforms implement new concepts to overcome current bottlenecks of the techniques and enable the embedding of sensors in actual operations. Innovative measurement concepts, such as low size and low power at high frequencies with high accuracy interrogator units for FBG sensors, will be developed using:
i. Photonic Integrated Circuits (PIC), to take advantage of low losses and highly integrated architecture.
ii. Dispersive Bragg Spectrometer (DBS), to interrogate hundreds of measurements at a sampling frequency of several hundreds of kHz. Wireless capabilities will also be developed by taking into account:
iii. The high amount of data to be efficiently processed (high frequencies, numerous sensors).
iv. The capacity of systems to be fully autonomous (inductive coupling for energy harvesting of piezoelectric actuators
and sensors).

The Work Package Leader is  Prof. Antonio Fernando-Lopez from UPM.

5 positions filled

• DC01 - Design and development of photonic integrated circuits for optical fibre sensing interrogation
• DC02 - High speed/High capacity distributed FBG sensing for SHM applications
• DC03 - Efficient sensor data acquisition via compressed sensing for autonomous sensor applications
• DC04 - Embedded self-powered sensor devices for passive monitoring of composite components
• DC11 - Embedded wireless sensor devices for monitoring composite components